发明名称 CONDUCTIVE PATTERN FORMING METHOD AND INK FOR PHOTONIC CURING
摘要 PROBLEM TO BE SOLVED: To provide a conductive layer production method which does not cause scattering even when irradiating a layer of an ink for photonic curing with high energy light, and to provide an ink for photonic curing.SOLUTION: A conductive pattern is produced by: preparing the ink for photonic curing which contains first conductivity imparting particles having an average particle diameter of 0.5-4 μm and second conductivity imparting particles having an average particle diameter of 0.01-0.5 μm in such an amount that the ratio of the first conductivity imparting particles to the second conductivity imparting particles is 70:30 to 95:5, and which contains an organic binder whose content is 0.2-2.0 mass% based on the total mass of the first and second conductivity imparting particles and the organic binder; printing the ink for photonic curing on a substrate; and irradiating an ink pattern for photonic curing with light to cure the first conductivity imparting particles and the second conductivity imparting particles in the ink pattern for photonic curing.
申请公布号 JP2014127501(A) 申请公布日期 2014.07.07
申请号 JP20120281126 申请日期 2012.12.25
申请人 SHOWA DENKO KK 发明人 MIYAMURA YASUNAO;OKAZAKI ERI;HARA MASANAO
分类号 H05K3/12;B22F1/00;C09D11/02;H01B1/00;H01B1/22;H01B13/00 主分类号 H05K3/12
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