发明名称 |
CONDUCTIVE PATTERN FORMING METHOD AND INK FOR PHOTONIC CURING |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive layer production method which does not cause scattering even when irradiating a layer of an ink for photonic curing with high energy light, and to provide an ink for photonic curing.SOLUTION: A conductive pattern is produced by: preparing the ink for photonic curing which contains first conductivity imparting particles having an average particle diameter of 0.5-4 μm and second conductivity imparting particles having an average particle diameter of 0.01-0.5 μm in such an amount that the ratio of the first conductivity imparting particles to the second conductivity imparting particles is 70:30 to 95:5, and which contains an organic binder whose content is 0.2-2.0 mass% based on the total mass of the first and second conductivity imparting particles and the organic binder; printing the ink for photonic curing on a substrate; and irradiating an ink pattern for photonic curing with light to cure the first conductivity imparting particles and the second conductivity imparting particles in the ink pattern for photonic curing. |
申请公布号 |
JP2014127501(A) |
申请公布日期 |
2014.07.07 |
申请号 |
JP20120281126 |
申请日期 |
2012.12.25 |
申请人 |
SHOWA DENKO KK |
发明人 |
MIYAMURA YASUNAO;OKAZAKI ERI;HARA MASANAO |
分类号 |
H05K3/12;B22F1/00;C09D11/02;H01B1/00;H01B1/22;H01B13/00 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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