发明名称 CONDUCTOR EXPOSURE METHOD OF WIRE HARNESS, CONDUCTOR EXPOSURE STRUCTURE OF WIRE HARNESS, WIRE HARNESS, AND CONDUCTOR CONNECTION STRUCTURE OF WIRE HARNESS
摘要 PROBLEM TO BE SOLVED: To provide a conductor exposure method of a wire harness, a conductor exposure structure of a wire harness, a wire harness and a conductor connection structure of a wire harness, in which a conductor is satisfactorily shaped and conductivity is improved.SOLUTION: A conductor exposure method in the vicinity of an axial end portion or an intermediate portion of a wire harness in which a plurality of insulation electric wires each including a conductor and an insulation layer covering a circumferential surface of the conductor are arranged in a stripe shape, includes steps of: laser-removing a plurality of insulation layers in a conductor exposure work region in the vicinity of the axial end portion or the intermediate portion of the wire harness while excluding axial one or more locations; and sliding residual locations of the plurality of insulation layers in the conductor exposure work region to axial one side with respect to the conductor after the laser removal. It is preferable that the residual locations of the insulation layers in the laser removal step are a plurality of locations disposed at equal intervals between the conductor exposure work regions.
申请公布号 JP2014128083(A) 申请公布日期 2014.07.07
申请号 JP20120281863 申请日期 2012.12.25
申请人 SUMITOMO ELECTRIC IND LTD 发明人 NAKATSUGI KYOICHIRO;TANAKA MASATO
分类号 H02G1/12;H01B7/00;H01B7/08;H01B13/00;H01B13/012;H01R12/62;H01R43/28 主分类号 H02G1/12
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