| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing device which can suitably polish the peripheral side surface of a processed material having various diameter sizes.SOLUTION: A polishing device comprises an installation part to which a processed material is installed, a first holding part, and a rotary part. The first holding part holds a first polishing part for polishing the peripheral side surface of the processed material in the state such that the first polishing part faces the peripheral side surface of the processed material, and the rotary part rotates the first holding part with respect to the peripheral side surface of the processed material. The first holding part has a first fitting part to which the first polishing part is fitted, a first weight part, a first support part, and a first movement part. The first support part is provided with the first fitting part on a first side area in a radial direction around a rotational axis of the rotary part, and the first weight part on a second side area in a radial direction which is opposite to the first side area via the processed material. The first movement part moves the first support part along the radial direction. The first weight part generates a centrifugal force by which the first support part is moved via the first movement part to the side on which the first fitting part approaches the peripheral side surface of the processed material with rotation of the first holding part.</p> |
