| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic product having a high degree of freedom of layout of components.SOLUTION: A power conversion device in which one or a plurality of semiconductor devices 3 mounted on an electronic printed circuit board 2 are housed in an electrical component box 9 includes: a heat-receiving portion 5 provided in contact with the semiconductor devices 3; a heat-transmitting portion 6 provided in contact with the heat-receiving portion; and a heat pipe having a heat-radiating portion 7 provided in contact with the heat-transmitting portion. A heat-radiating surface of the heat-radiating portion 7 is disposed along the outline of the electrical component box 9, and the heat-radiating portion 7 is disposed at a higher position than the heat-receiving portion 5. A coolant in the heat pipe has a configuration that spontaneously circulates by the gravity and temperature gradient.</p> |
