发明名称 FLUX AND SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To provide a flux for soldering that exhibits excellent advantages of a solder paste in all of printing properties, wettability and crack resistance of flux residue.SOLUTION: A flux for soldering contains an acrylic resin (A) and an acrylic resin (B) as base resins. The acrylic resin (A) has an acid value of 0 to 70 and formed by polymerizing a monomer mixture containing an alkyl(meth)acrylate of which alkyl group has 12 to 23 carbon atoms, and the acrylic resin (B) has an acid value of 30 to 230 and formed by polymerizing a monomer mixture containing an alkyl(meth)acrylate of which alkyl group has 6 to 10 carbon atoms. The acid value of the acrylic resin (B) is higher than that of the acrylic resin (A) by a difference of 15 or more. Further, a solder paste composition contains the flux and solder alloy powder.
申请公布号 JP2014124657(A) 申请公布日期 2014.07.07
申请号 JP20120282542 申请日期 2012.12.26
申请人 HARIMA CHEMICALS INC;DENSO CORP 发明人 INOUE TAKASUKE;SHIGESADA TETSUYUKI;TAKESHIMA KENICHI;SUKEGAWA TAKUSHI;MURATA MASAO
分类号 B23K35/363;B23K3/06;B23K35/22;B23K35/26;B23K101/42;C22C13/00;H05K3/34 主分类号 B23K35/363
代理机构 代理人
主权项
地址