| 摘要 |
PROBLEM TO BE SOLVED: To suppress resin biting (a state in which a resin enters between terminals to eliminate a coupling state between a terminal, a solder layer, and a terminal) that may result from release of a load in techniques for laminating a plurality of electronic components each of which has a terminal on a surface thereof with a resin layer sandwiched therebetween, applying a load while heating a laminate, coupling the terminal, the solder layer, and the terminal to laminate them in a multiple of stages without performing solder joint, and collectively performing solder joint between the plurality of electronic components (between terminals).SOLUTION: A method for manufacturing an electronic device comprises a first laminating step, a first releasing step, a second laminating step, a second releasing step, a first jointing step, and a solder ball forming step. A second load in the first jointing step is larger than a first A load in the first laminating step and a first B load in the second laminating step. |
