| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that allows relaxing the influence of parasitic capacitance caused by a package and improving characteristics.SOLUTION: A semiconductor device includes: a base having a mounting portion with conductivity and terminals insulated from the mounting portion; and a semiconductor element provided on the mounting portion. The semiconductor element has electrodes electrically connected to the terminals on the surface opposite to the surface in contact with the mounting portion. Moreover, the mounting portion and the terminals are electrically connected via a resistor. The resistance R of the resistor is larger than the inverse of the product ωC of the capacitance value C between the mounting portion and the terminals and the angular frequency ω of an electrical signal outputted from the semiconductor element. |
