APPARATUS FOR PROCESSING SUBSTRATE

摘要

The present invention relates to an apparatus for processing a substrate, capable of minimizing damage of the substrate and degradation of a layer caused by plasma discharge by preventing plasma discharge from reach the substrate. The apparatus for processing a substrate according to the present invention includes a process chamber to provide a process space and a gas injection module which is installed in the process chamber and separates and inject process gas onto the substrate by using plasma. The gas injection module includes: a lower frame having a plurality of electrode insertion portions; an upper frame including a plurality of protrusion electrodes inserted into the electrode insertion portions to have a gap space and a process gas injection hole formed in the protrusion electrodes so that the process gas is injected on the substrate; and an insulation plate which is formed between the upper frame and the lower frame and includes a plurality of electrode penetrating portions through which the protrusion electrode electrodes penetrate to be inserted into the electrode insertion portions.