PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM PHOTORESIST FORMED THEREOF

摘要

The present invention relates to a photosensitive resin composition and, more specifically, provides a photosensitive resin composition and a dry film photoresist manufactured therefrom, which have enhanced chemical resistance for developing and etching, thereby performing enhanced circuit properties; and have rapid exfoliation speed and a characteristic where exfoliation pieces are split into small pieces, thereby being suitable for a dry film photoresist or the like.