| 摘要 |
<p>PURPOSE: A mold for manufacturing a semiconductor package is provided to process semiconductor packages having different thickness by vertically moving a die according to a thickness change of the semiconductor package. CONSTITUTION: A top mold module(200) is movably installed on a bottom mold module(100). A die is arranged under a semiconductor package in order to support the semiconductor package or a lead frame, and includes a fixing die(121) and a movable die(122). The fixing die is fixed to the bottom mold module. The movable die is movably installed to the bottom mold module. A die lifting unit vertically moves the movable die according to thickness of the semiconductor package. A punch(230) is installed to the top mold module, and pressurizes a part of the lead frame or the semiconductor package.</p> |
