| 摘要 |
PROBLEM TO BE SOLVED: To achieve at least one of reduction of cost, reduction of energy consumption, enhancement of responsiveness and reduction of heat loss, as regards temperature control for a polishing pad in a substrate polishing device.SOLUTION: A substrate polishing device comprises: a polishing table which is rotatable and is used for sticking a polishing pad to it; a gas supply part for supplying reactant gas; a heat transmission part having a body in which a gas passage for circulating the reactant gas is formed in its inside in a state that the polishing pad is stuck to the polishing table and which is disposed on a surface of the polishing pad while coming in contact with the polishing pad or while approximating to the polishing pad, and having a catalyst which is disposed in the gas passage and promotes exothermic reaction of the reactant gas, and transmits heat generated by exothermic reaction to the polishing pad; a temperature detection part for detecting a temperature of the surface of the polishing pad; and a gas supply amount control part which controls the amount of the reactant gas supplied from the gas supply part to the heat transmission part on the basis of the temperature detection result. |
