POLISHING APPARATUS AND POLISHING METHOD

摘要

A polishing apparatus (100) comprises: a holding and supporting stage(4) for holding and supporting a center of rear surface of a substrate (W); a motor (M1) for rotating the holding and supporting stage (4); a front surface nozzle (36) for supplying rinsing liquid to the front surface of the substrate (W); a rear surface nozzle (37) for supplying the rinsing liquid to the rear surface of the substrate (W); a rinsing liquid controlling unit (110) for supplying the rinsing liquid through the front surface nozzle (36) and supplying the rinsing liquid through the rear surface nozzle (37) after a predetermined time; and a polishing head assembly (1A) for polishing a peripheral part of the substrate installed in the holding and supporting stage (4) after the rinsing liquid controlling unit (110) supplies the rinsing liquid to the substrate (W).