| 摘要 |
A CMP slurry composition according to the present invention includes: ceria particles having a negative surface potential; a phosphate compound having more than one phosphate group; and deionized water, while having the pH below 7. The surface potential of the ceria particles ranges from -10 to -50 mV, and the phosphate compound takes up 0.01 to 0.5 wt% among the entire composition, while having more than three phosphate groups. In addition, the pH of the composition ranges from 4-7. |
