| 摘要 |
PROBLEM TO BE SOLVED: To dissipate heat generated during operation in a light emitting device.SOLUTION: An insulation layer 120 is formed in the first surface side of a translucent substrate 100, and opposite the translucent substrate 100 via a first electrode 110. The insulation layer 120 does not overlap an organic functional layer 140 in plan view, but overlaps at least an edge of the first electrode 110. A heat dissipation layer 130 is partially formed on the first surface side of the translucent substrate 100, and at least part of it overlaps the first electrode 110 in plan view. Part of the heat dissipation layer 130 is covered with the insulation layer 120, and another part is covered with neither the insulation layer 120 nor organic functional layer 140, thus serving as a heat dissipation part 132. In the present embodiment, the heat dissipation part 132 is located on an edge of the first electrode 110 and does not overlap the second electrode 150 either. |
