发明名称 DESMEARING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a desmearing method capable of removing smear caused by an inorganic material and an organic material reliably, without using a chemical requiring waste liquid treatment.SOLUTION: A desmearing method of a wiring board material produced by laminating an insulating layer composed of a resin containing filler, and a conductive layer includes a wet ultraviolet light irradiation step for irradiating the treated part in the wiring board material with ultraviolet light under wet state, and a physical vibration step for giving physical vibration to the wiring board material passed through the wet ultraviolet light irradiation step.</p>
申请公布号 JP2014127605(A) 申请公布日期 2014.07.07
申请号 JP20120283809 申请日期 2012.12.27
申请人 USHIO INC 发明人 HORIBE DAIKI;HIROSE KENICHI;ENDO SHINICHI
分类号 H05K3/42 主分类号 H05K3/42
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