发明名称 |
HARDENED BODY, METHOD OF MANUFACTURING THE SAME, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To materialize a hardened body causing sufficient dry film adhesion and having a small surface undulation even in the case of using a thin resin composition layer for thinning a layer and to suppress generation of unevenness in roughness when manufacturing a printed wiring board.SOLUTION: The hardened body 2 provided on a circuit board 5 is obtained by laminating a resin composition layer on a circuit board 3 and thermally hardening the resin composition layer. In the hardened body, when the lowest melting viscosity temperature in the resin composition layer is set as Tv (°C), the lamination temperature of the resin composition layer is Tv-35°C to Tv+35°C, and when the thickness of the resin composition layer and the thickness of the hardened body on the circuit wiring of the circuit board are set as x (μm) and y (μm) respectively, 0.3<y/x≤1 and y≤15. |
申请公布号 |
JP2014127643(A) |
申请公布日期 |
2014.07.07 |
申请号 |
JP20120284845 |
申请日期 |
2012.12.27 |
申请人 |
AJINOMOTO CO INC |
发明人 |
NAKAMURA SHIGEO;NARABASHI HIROHISA |
分类号 |
H05K3/38;H05K3/18 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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