A METHOD FOR CONNECTION USING A LASER

摘要

The present invention relates to a method for connecting a substrate which includes a first electrode to an electronic component which includes a second electrode which includes the steps of: arranging an anisotropic conductive adhesive on the substrate; arranging the electronic component on the anisotropic conducive adhesive and temporarily pressurizing the substrate to the electronic component; and radiating a laser beam to the anisotropic conductive adhesive. A distance between the first electrode of the substrate and the second electrode of the electronic component is double the average diameter of a conductive particle included in the anisotropic conductive adhesive or less.