| 摘要 |
Disclosed are a copper titanium plate with excellent strength, conductivity, and bendability, and a production method therefor. The high-strength copper titanium plate includes 2.5 to 4.0 mass% Ti, with the remainder comprising Cu and unavoidable impurities, wherein the tensile strength is at least 950 MPa, the 0.2% proof stress is 0.9 times the tensile strength, and the ratio (MBR/t) between the plate thickness (t) and the minimum bending radius (MBR) at which breaking does not occur is no more than 1.0 when a W bending test is performed in a manner such that the bending axis becomes parallel with the rolling direction. |
