| 摘要 |
An apparatus for processing a surface of a printed circuit board includes a process container, a first spray unit, a second spray unit, and a transfer unit. The process container is divided into a first region and a second region. The first spray unit is installed in the first region and sprays liquid of a high temperature on a substrate with a metal terminal on at least one side thereof. A second spray unit is installed in the second region and sprays melted solder on the metal terminal of the substrate. The transfer unit transfers the substrate between the first spray unit and the second spray unit to coat the metal terminal with the melted solder sprayed from the second spray unit when the metal terminal is preheated by the liquid of the high temperature sprayed from the first spray unit and to etch a part of the solder coated on the metal terminal by the liquid of the high temperature sprayed from the first spray unit. |
