发明名称 APPARATUS FOR HARDENING ADHESIVE
摘要 The present invention relates to an apparatus for curing adhesive. The apparatus for curing adhesive according to the present invention includes: a chamber having an opening/closing member to form a closed space; a heating member buried on the inner bottom in the chamber; and a UV lamp installed on at least one position on the inner surface of the chamber. A curing time of the adhesive can be reduced as the adhesive is cured through the heating member and the UV lamp.
申请公布号 KR20140083216(A) 申请公布日期 2014.07.04
申请号 KR20120152692 申请日期 2012.12.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 MIN, CHANG KI
分类号 B05C9/12;B01J19/08;G21K5/00 主分类号 B05C9/12
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