发明名称 |
APPARATUS FOR HARDENING ADHESIVE |
摘要 |
The present invention relates to an apparatus for curing adhesive. The apparatus for curing adhesive according to the present invention includes: a chamber having an opening/closing member to form a closed space; a heating member buried on the inner bottom in the chamber; and a UV lamp installed on at least one position on the inner surface of the chamber. A curing time of the adhesive can be reduced as the adhesive is cured through the heating member and the UV lamp. |
申请公布号 |
KR20140083216(A) |
申请公布日期 |
2014.07.04 |
申请号 |
KR20120152692 |
申请日期 |
2012.12.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MIN, CHANG KI |
分类号 |
B05C9/12;B01J19/08;G21K5/00 |
主分类号 |
B05C9/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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