| 摘要 |
An epoxy resin composition to encapsulate a semiconductor device of the present invention comprises: an epoxy resin; a hardener; a hardening accelerator; and an inorganic filler, wherein the hardening accelerator is characterized by including a quaternary phosphonium salt or a quaternary ammonium salt represented by chemical formula 1. The epoxy resin composition has excellent hardening properties, room temperature storage stability, mobility, cracking resistance, moisture resistant reliability and the like. In chemical formula 1, A_1 is nitrogen or a phosphorus. R_1, R_2, R_3 and R_4 are a substituted or nonsubstituted hydrocarbon group of C1-C30 or a substituted or nonsubstituted hydrocarbon group of C1-C30 including a hetero atom, respectively. X_1, X_2, X_3, X_4, X_5 and X_6 are an oxygen atom (O), a sulfur atom (S) or NH, respectively. Y_1, Y_2 and Y_3 are a substituted or nonsubstituted hydrocarbon group of C1-C30 or a substituted or nonsubstituted hydrocarbon group of C1-C30 including a hetero atom, respectively. |
