| 摘要 |
<p>An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element; a coating layer disposed on one side in a thickness direction of the embedding layer; and a barrier layer disposed between the embedding layer and the coating layer, having a thickness of 50-1,000μm, and for preventing the components contained in the coating layer from being transferred to the embedding layer.</p> |
