发明名称 CAPACITOR-EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>A capacitor-embedded substrate includes a base material having a desired thickness, and a pair of conductors (feedthrough electrodes) each formed in a desired pattern to penetrate through the base material in the thickness direction thereof, and oppositely disposed with an insulating layer interposed therebetween. The pair of electrodes are formed in comb-shaped patterns, and are oppositely disposed in such a manner that respective comb-tooth portions are meshed with each other.</p>
申请公布号 KR101414751(B1) 申请公布日期 2014.07.04
申请号 KR20080079720 申请日期 2008.08.14
申请人 发明人
分类号 H05K1/16;H05K3/46 主分类号 H05K1/16
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