| 摘要 |
The present invention relates to a method for manufacturing a multilayer chip inductor, for example, a method for manufacturing a multilayer surface mounted device (SMD). To achieve the objective of the present invention, the method for manufacturing a multilayer chip inductor comprises the steps of: manufacturing a laminated panel by compressing a magnetic panel having multiple coil insertion holes formed on a magnetic sheet in the form of a checkerboard and coils inserted into the coil insertion holes, magnetic films laminated on the top and bottom of the magnetic panel, and copper foils laminated on the top and bottom of the magnetic films; forming terminals by etching the copper foil on the surface of the laminated panel; forming a hole between the terminals of the laminated panel; masking the surface of the laminated panel except the terminals; forming external electrodes by plating copper on the laminated panel to continuously plate copper on the side surface of the hole and the terminal portion; removing the masking of the laminated panel; and cutting the laminated panel to include an inductor consisting of the internal coil and the external electrode. According to the method of the present invention, an electrode forming process is very simple, and an external electrode of uniform quality for each product can be formed. |
