| 摘要 |
The present invention relates to a flexible drive IC package mounted on a flexible film and a cutting device thereof. The flexible drive IC package includes a film on which a plurality of drive ICs is regularly mounted and sprocket holes are arranged with one pitch interval on both sides thereof. The film is cut with one unit including one or two drive ICs. The length of one unit is one pitch X N.x (mm). Wherein, the N is an integer greater or equal to one. The x is a decimal below a point. |
