发明名称 SUBSTRATE FOR FORMIMG CONDUCTIVE PATTERN AND CONDUCTIVE PATTERN FORMED BY USING THE SAME
摘要 <p>The present invention relates to an adhesive substrate for forming a conductive pattern, which includes an adhesive substrate, and a precursor pattern of a conductive pattern, or a conductive pattern, provided on one side of the adhesive substrate, a method for preparing a conductive pattern using the adhesive substrate, a conductive pattern prepared using the adhesive substrate, and an electronic device including the conductive pattern.</p>
申请公布号 KR101410518(B1) 申请公布日期 2014.07.04
申请号 KR20130044167 申请日期 2013.04.22
申请人 发明人
分类号 G02F1/1343;H01L21/027 主分类号 G02F1/1343
代理机构 代理人
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