发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
The present invention relates to a printed circuit board and a manufacturing method thereof. The printed circuit board according to the present invention includes a burying part in which a first device is buried and a cavity in which a second device is mounted. According to the present invention, the total thickness of the printed circuit board to bury or mount devices such as a controller chip and an image sensor can be reduced. |
申请公布号 |
KR20140083314(A) |
申请公布日期 |
2014.07.04 |
申请号 |
KR20120152907 |
申请日期 |
2012.12.26 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JUNG, WON SUK;AN, YUN HO;HAN, JOON WOOK;LEE, SANG MYUNG |
分类号 |
H05K3/46;H05K1/18 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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