COMPOSITION FOR ENCAPSULANT AND ENCAPSULANT AND ELECTRONIC DEVICE

摘要

The present invention relates to a composition for an encapsulant composition comprising a first polysiloxane including a part represented by formula 1 and an alkenyl group combined with silicon (Si-Vi) at the terminal thereof and a second polysiloxane including hydrogen combined with silicon (Si-H) at the terminal thereof, an encapsulant obtained by curing the composition for encapsulant, and an electronic device including the encapsulant. In formula 1, the definitions of A and R^1 to R^4 are described in the specification.