SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

摘要

A semiconductor apparatus according to one embodiment of the present technique includes a semiconductor substrate, an active region which has a designated part which is electrically connected to the semiconductor substrate and the residual part except the designated part which is floated in the upper part of the semiconductor substrate and is extended in a first direction, a word line which is vertical to the first direction on the active region, a bonding region which is formed in the active region of both sides of the word line, and an air gap which is formed in the bonding region between the semiconductor substrate and the active region.