| 摘要 |
The present invention relates to a bonding apparatus for a bending type flexible printed circuit board (FPC) to accurately bond the FPC, which is bent in a predetermined shape, to two locations spaced apart from each other on a display device. The bonding apparatus for the bending type FPC according to the present invention includes: an anisotropic conduction resin (ACR) attaching module to attach an ACR to the two locations spaced apart from each other on the display panel; a pre-bonding module disposed adjacent to the ACR attaching module to pre-bond the bending type flexible printed circuit board (FPC) to the display panel, on which the anisotropic conduction resin is attached; an FPC providing module disposed adjacent to the pre-bonding module to provide the bending type flexible printed circuit board to the pre-bonding module by bending the flexible printed circuit board; and a main bonding module disposed adjacent to the pre-bonding module to bond the bending type flexible printed circuit board pre-bonded by the pre-bonding module. |
