发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To achieve cost reduction of a multi-pin semiconductor device.SOLUTION: A flip-chip connected BGA comprises: a plurality of signal bonding electrodes 2k which are arranged on an outer periphery of a top face of a multilayer wiring board and extracted inside and outside in a distributed manner; and a plurality of signal through holes 2q which are connected with a plurality of signal distribution lines 2u extracted inside and arranged in a region between an electrode row of the plurality of signal bonding electrodes 2k and a central part where a plurality of core power supply bonding electrodes are arranged. With this configuration, a pad pitch between chips can be reduced to achieve cost reduction of the BGA without increase on the number of layers of the multilayer wiring board.</p>
申请公布号 JP2014123783(A) 申请公布日期 2014.07.03
申请号 JP20140070736 申请日期 2014.03.31
申请人 RENESAS ELECTRONICS CORP 发明人 BABA SHINJI ; IWASAKI TOSHIHIRO ; WATANABE MASAKI
分类号 H01L23/12;H01L21/60 主分类号 H01L23/12
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