METHOD OF MANUFACTURING SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, METHOD OF MANUFACTURING LIGHT-EMITTING PACKAGE, AND SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a substrate for mounting a light-emitting element having favorable heat radiation properties and capable of forming a groove of a wiring pattern with high precision.SOLUTION: A pair of wiring patterns is formed such that a metal layer provided on one of surfaces of a substrate having insulating properties is separated by a groove having a first spacing. A pair of charging portions are formed at a second spacing by charging a metal into each of a pair of through holes provided in the substrate so as to contact each of the pair of wiring patterns and be exposed to a surface opposite to said one surface of the substrate. When the pair of wiring patterns is formed, wet etching is performed on the metal layer from a surface to a predetermined depth, and the groove having the first spacing is formed by performing laser processing from the predetermined depth to a depth at which the metal layer is penetrated. The pair of charging portions is formed such that an area of each of the charging portions equals to or exceeds 50% of an area of each of the wiring patterns.