发明名称 COMPONENTS WITH NEAR-SURFACE COOLING MICROCHANNELS AND METHODS FOR MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide methods for providing a near-surface cooling microchannel in a component without sacrificing strength and toughness of the component itself and without the need for additional resources and labor such as machining.SOLUTION: The methods include forming a near-surface cooling microchannel in a first surface of a pre-sintered preform, disposing the first surface of the pre-sintered preform onto an outer surface of the base article such that an opening of the outer surface of the base article is aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform, and, heating the pre-sintered preform to bond it to the base article, where the opening of the outer surface of the base article remains aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform. A component 10 comprising a turbine bucket is disclosed in which an airfoil 12 includes internal cooling passages 18 (e.g., cooling holes) through which bleed air that enters the component 10 through a root section 14 of the component 10 is forced to transfer heat from the component.</p>
申请公布号 JP2014122423(A) 申请公布日期 2014.07.03
申请号 JP20130259696 申请日期 2013.12.17
申请人 GENERAL ELECTRIC CO &lt,GE&gt, 发明人 DAVID EDWARD SCHICK;KOTTILINGAM SRIKANTH CHANDRUDU;LACY BENJAMIN PAUL;HARRIS JR JOHN WESLEY
分类号 B22F5/04;B22F3/16;C22C1/04;C22C19/05;F01D5/18;F01D5/28;F01D9/02;F02C7/00 主分类号 B22F5/04
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