发明名称 |
COMPONENTS WITH NEAR-SURFACE COOLING MICROCHANNELS AND METHODS FOR MANUFACTURING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide methods for providing a near-surface cooling microchannel in a component without sacrificing strength and toughness of the component itself and without the need for additional resources and labor such as machining.SOLUTION: The methods include forming a near-surface cooling microchannel in a first surface of a pre-sintered preform, disposing the first surface of the pre-sintered preform onto an outer surface of the base article such that an opening of the outer surface of the base article is aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform, and, heating the pre-sintered preform to bond it to the base article, where the opening of the outer surface of the base article remains aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform. A component 10 comprising a turbine bucket is disclosed in which an airfoil 12 includes internal cooling passages 18 (e.g., cooling holes) through which bleed air that enters the component 10 through a root section 14 of the component 10 is forced to transfer heat from the component.</p> |
申请公布号 |
JP2014122423(A) |
申请公布日期 |
2014.07.03 |
申请号 |
JP20130259696 |
申请日期 |
2013.12.17 |
申请人 |
GENERAL ELECTRIC CO <,GE>, |
发明人 |
DAVID EDWARD SCHICK;KOTTILINGAM SRIKANTH CHANDRUDU;LACY BENJAMIN PAUL;HARRIS JR JOHN WESLEY |
分类号 |
B22F5/04;B22F3/16;C22C1/04;C22C19/05;F01D5/18;F01D5/28;F01D9/02;F02C7/00 |
主分类号 |
B22F5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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