发明名称 BACKPLANE APPARATUS AND COMMUNICATION DEVICE
摘要 A backplane apparatus, including a first backplane structure and a second backplane structure, where the first backplane structure is configured to transmit power and low-speed signals, and the second backplane structure is configured to transmit high-speed signals, low-speed signals, or optical signals. The first backplane structure includes a first backplane, multiple first connectors, and a connected space, where the first connectors are arranged on the first backplane and boards are electrically connected to the first backplane. The second backplane structure includes multiple second backplanes and multiple second connectors, where the second connectors are arranged on the second backplanes, the second backplanes are installed on the first backplane, and the second connectors are electrically connected to boards by crossing the connected space or via the first connectors. The present invention also discloses a communication device.
申请公布号 US2014187062(A1) 申请公布日期 2014.07.03
申请号 US201314107473 申请日期 2013.12.16
申请人 HUAWEI TECHNOLOGIES CO., LTD. 发明人 LIU Fangming;Zhang Guodong;Liu Sang
分类号 H01R12/50 主分类号 H01R12/50
代理机构 代理人
主权项 1. A backplane apparatus, configured to provide a channel and an interface for boards and comprising: at least one first backplane structure; and at least one second backplane structure, wherein the first backplane structure is configured to transmit power and low-speed signals; the second backplane structure is configured to transmit high-speed signals, low-speed signals, or optical signals; and the first backplane structure comprises at least one first backplane, multiple first connectors, and at least one connected space, wherein the first connectors are arranged on the first backplane, and the boards are electrically connected to the first backplane via the first connectors; and the second backplane structure comprises multiple second backplanes and multiple second connectors, wherein the second connectors are arranged on the second backplanes, the second backplanes are installed on the first backplane, and the second connectors are electrically connected to the boards by crossing the connected space or via the first connectors.
地址 Shenzhen CN