发明名称 RESIN COMPOSITION, COVERING METHOD USING SAME, AND COVERED STRUCTURE COVERED BY SAID METHOD
摘要 The purpose of the present invention is to provide: a resin composition which has low odor, excellent coating film drying properties and excellent secondary adhesiveness, and which provides a cured product that has excellent toughness and durability; a covering material which contains this resin composition; and a covering method which uses this covering material. In order to achieve the above-mentioned purpose, the present invention provides: a resin composition which is obtained by blending (A) at least one kind of resin that is selected from the group consisting of polyester (meth)acrylate resins, urethane (meth)acrylate resins and epoxy (meth)acrylate resins, (B) an itaconic acid ester, (C) a radically polymerizable monomer other than a styrene monomer and (D) a wax; a covering method which uses this resin composition; and a covered structure which is covered by this method.
申请公布号 WO2014103878(A1) 申请公布日期 2014.07.03
申请号 WO2013JP84103 申请日期 2013.12.19
申请人 SHOWA DENKO K.K. 发明人 KANAYAMA, JUN;KUROKI, KUNIHIRO
分类号 C08F290/06;C09D4/00;C09D4/02;C09D163/10;C09D167/06;C09D175/16 主分类号 C08F290/06
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