| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring circuit board in which the occurence of deflection or breakage of a terminal part can be suppressed before and after manufacturing, and a method for manufacturing the same.SOLUTION: A method for manufacturing a wiring circuit board includes: preparing a support substrate 2; forming a base insulating layer 3 having a base-side opening 23 and a plurality of terminal formation parts 27 on a top surface of the support substrate 2; forming a conductor pattern 4 having a plurality of external-side terminals 14 corresponding to the plurality of terminal formation parts 27 on a top surface of the base insulating layer 3; forming a support substrate-side opening 22 including all of the plurality of external-side terminals 14, when projecting in a thickness direction, by partially removing the support substrate 2, and reinforcement support parts 25 disposed between the plurality of terminal formation parts 27; and exposing both of upper and lower surfaces of the plurality of external-side terminals 14 by removing the plurality of terminal formation parts 27 exposed from the support substrate-side opening 22.</p> |
