发明名称 METHOD FOR MANUFACTURING SHIELDING PRINTED WIRING BOARD, SHIELDING FILM, AND SHIELDING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a shielding printed wiring board, a shielding film, and a shielding printed wiring board which can reduce a cost.SOLUTION: A method for manufacturing a shielding printed wiring board 10 includes the steps of: forming a shielding film 1 which has an insulating layer 7 which is a resin that has been polymerized until the degree of cure of a resin is equal to or larger than 90%, a metal layer 8a stacked on the insulating layer 7, and an adhesive layer 8b stacked on the metal layer 8a; mounting the shielding film 1 on a printed circuit board 5; and heating and pressing the shielding film 1 and the printed circuit board 5.
申请公布号 JP2014123630(A) 申请公布日期 2014.07.03
申请号 JP20120278551 申请日期 2012.12.20
申请人 TATSUTA ELECTRIC WIRE & CABLE CO LTD 发明人 TAJIMA HIROSHI;IWASAKI MASAYOSHI;UENO KENJI;HARUNA YUSUKE
分类号 H05K1/02;B32B15/08;H05K9/00 主分类号 H05K1/02
代理机构 代理人
主权项
地址