发明名称 |
METHOD FOR MANUFACTURING SHIELDING PRINTED WIRING BOARD, SHIELDING FILM, AND SHIELDING PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a shielding printed wiring board, a shielding film, and a shielding printed wiring board which can reduce a cost.SOLUTION: A method for manufacturing a shielding printed wiring board 10 includes the steps of: forming a shielding film 1 which has an insulating layer 7 which is a resin that has been polymerized until the degree of cure of a resin is equal to or larger than 90%, a metal layer 8a stacked on the insulating layer 7, and an adhesive layer 8b stacked on the metal layer 8a; mounting the shielding film 1 on a printed circuit board 5; and heating and pressing the shielding film 1 and the printed circuit board 5. |
申请公布号 |
JP2014123630(A) |
申请公布日期 |
2014.07.03 |
申请号 |
JP20120278551 |
申请日期 |
2012.12.20 |
申请人 |
TATSUTA ELECTRIC WIRE & CABLE CO LTD |
发明人 |
TAJIMA HIROSHI;IWASAKI MASAYOSHI;UENO KENJI;HARUNA YUSUKE |
分类号 |
H05K1/02;B32B15/08;H05K9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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