| 摘要 |
PROBLEM TO BE SOLVED: To provide a tin-plated electroconductive material in which the barrier properties of an underlying base material comprising Cu or a Cu alloy are enhanced, and diffusion of Cu is surely prevented to improve the heat resistance thereof and which can keep stabilized contact resistance even under a high-temperature environment and to provide a production method of the tin-plated electroconductive material.SOLUTION: The tin-plated electroconductive material is obtained by forming a Ni layer, an intermediate layer comprising a Cu-Sn alloy layer, a surface layer comprising Sn or a Sn alloy in this order on the surface of the base material which has no work-affected layer and comprises Cu or the Cu alloy. The Ni layer is grown epitaxially on the base material. The average diameter of crystal grains of the Ni layer is 1 μm or larger. The thickness of the Ni layer is 0.1-1.0 μm, that of the intermediate layer is 0.2-1.0 μm, and that of the surface layer is 0.5-2.0 μm. |
