发明名称 STACKED CERAMIC CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND CIRCUIT SUBSTRATE ON WHICH STACKED CERAMIC CAPACITOR IS MOUNTED
摘要 PROBLEM TO BE SOLVED: To provide a stacked ceramic capacitor excellent in static capacitance and package density, a method of manufacturing the same, and a package circuit substrate of the capacitor.SOLUTION: There is provided a stacked ceramic capacitor comprising: a first internal electrode 121 including a first pattern part 121a and a first non-pattern part 121b, an end portion of the first pattern part 12a being exposed to a first side surface and a second side surface opposed to each other of a ceramic main body including a dielectric layer 111 and one or more surfaces of a first end surface and a second end surface opposed to each other; a second internal electrode including a region overlapping with the first pattern part, and a second pattern part and a second non-pattern part, an end portion of the second pattern part being exposed to the first and second side surfaces and one or more surfaces of the first and second end surfaces; and a metallic oxide region 121a' which includes a first external electrode and a second external electrode connected to the first and second internal electrodes, and in which the first and second pattern parts are formed at a predetermined width so as to extend from an exposed end portion included in the exposed end portions of the first and second pattern parts and provided in a region not connected to the first or second external electrode toward a central part of the first and second pattern parts.
申请公布号 JP2014123696(A) 申请公布日期 2014.07.03
申请号 JP20130036859 申请日期 2013.02.27
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM JUN HI
分类号 H01G4/232;H01G4/30;H05K1/18 主分类号 H01G4/232
代理机构 代理人
主权项
地址