| 发明名称 |
SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING THE SAME, AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A substrate for a semiconductor package includes a substrate body having a first surface and a second surface which faces away from the first surface, and formed with at least one bump land on the first surface, and a dam formed and projected over an edge of the first surface of the substrate body, and having an underfill member discharge unit. |
| 申请公布号 |
US2014183724(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201313827289 |
申请日期 |
2013.03.14 |
| 申请人 |
SK HYNIX INC. |
发明人 |
YANG Seung Taek |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate for a semiconductor package, comprising:
a substrate body having a first surface and a second surface which faces away from the first surface, and formed with at least one bump land on the first surface; and a dam formed and projected over an edge of the first surface of the substrate body, and having an underfill member discharge unit. |
| 地址 |
Icheon-si KR |
