发明名称 PHOTORESIST COMPOSITION AND METHOD FOR FORMING A METAL PATTERN
摘要 A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer and a mixed solvent including a first solvent, a second solvent having a higher volatility than the first solvent, and a third solvent having a higher volatility than the second solvent. The coating layer is exposed to light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.
申请公布号 US2014183162(A1) 申请公布日期 2014.07.03
申请号 US201313911984 申请日期 2013.06.06
申请人 Samsung Display Co., LTD. 发明人 CHO Ki-Hyun;KANG Hoon;KIM Jae-Sung;KIM Dong-Min;KIM Seung-Ki;JEAGAL Eun
分类号 G03F7/40;G03F7/038 主分类号 G03F7/40
代理机构 代理人
主权项 1. A photoresist composition comprising: a binder resin; a photo-sensitizer; and a mixed solvent including a first solvent, a second solvent having a higher volatility than the first solvent, and a third solvent having a higher volatility than the second solvent.
地址 Yongin-City KR