| 发明名称 |
LOW-VISCOSITY METAL INK COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME |
| 摘要 |
<p>The present invention relates to a metal ink composition and to a printed circuit board using same, wherein the metal ink composition can form a thin film circuit pattern having an excellent property of adhering to a substrate and high conductivity without performing a surface treating process on the substrate.</p> |
| 申请公布号 |
WO2014104737(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
WO2013KR12164 |
申请日期 |
2013.12.26 |
| 申请人 |
DOOSAN CORPORATION |
发明人 |
PARK, HAN SUNG;LEE, HYUN JIN;RYU, EUI DOCK;KIM, WOO JEONG;LYU, JUNG SUP |
| 分类号 |
C09D11/00;C09D11/10;H01B1/22;H05K1/09 |
主分类号 |
C09D11/00 |
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