| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and a device of thermal compression bonding for mounting a semiconductor chip on a substrate.SOLUTION: A method of thermal compression bonding for mounting a semiconductor chip 5 on a substrate 4 comprises the steps of: picking up the semiconductor chip with a chip gripper 8 movably mounted on a TC bonding head 2; positioning the chip gripper above a place of the allocated substrate; lowering the TC bonding head to a position where the chip gripper is deflected with respect to the TC bonding head by a predetermined distance; heating the semiconductor chip to a temperature exceeding a melting temperature of solder to cancel the deflection of the chip gripper; waiting until the temperature of the semiconductor chip is decreased to a value equal to or lower than the melting temperature of solder; and taking up the TC bonding head.</p> |
