| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide: a degreasing agent for photosolder resist pre-processing which does not reduce bondability between a printed wiring board and PSR ink, has excellent detergency, and can significantly reduce the number of exposed-copper defects and SR foreign matter defects; and a degreasing method using the same.SOLUTION: The degreasing agent for photosolder resist pre-processing comprises glycol ether, alcoholamine, an amine-based surfactant and water.</p> |
