| 发明名称 |
ELECTRONIC COMPONENT |
| 摘要 |
According to one embodiment, an electronic component includes a device having a plurality of electrodes; a lead electrically connected to each of the plurality of electrodes; a first resin body sealing the device and a portion of the lead; and a first conductive body connected to the leads and contactable with a second conductive body. |
| 申请公布号 |
US2014183555(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314077843 |
申请日期 |
2013.11.12 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
IKEDA Kentaro |
| 分类号 |
H01L23/60;H01L29/20;H01L29/16;H01L23/31 |
主分类号 |
H01L23/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component comprising:
a device having a plurality of electrodes; a lead electrically connected to each of the plurality of electrodes; a first resin body sealing the device and a portion of the lead; and a first conductive body connected to the leads and contactable with a second conductive body. |
| 地址 |
Minato-ku JP |
