| 发明名称 |
PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers. |
| 申请公布号 |
US2014182911(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314073206 |
申请日期 |
2013.11.06 |
| 申请人 |
SAMSUNG ELECTRO-MECHANCIS CO., LTD. |
发明人 |
Lee Seung Eun;SHIN Yee Na;CHUNG Yul Kyo;LEE Doo Hwan |
| 分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) including an embedded electronic component, the printed circuit board comprising:
a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers. |
| 地址 |
Suwon KR |
