| 发明名称 |
HEAT TRANSFER DEVICE FOR WAVE SOLDERING |
| 摘要 |
A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane. |
| 申请公布号 |
US2014182909(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201313732475 |
申请日期 |
2013.01.02 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Hugo Stephen M.;Kelly Matthew S. |
| 分类号 |
H05K3/34;H05K1/02 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
a circuit board comprising a plane and a pin-in-hole component; and a heat transfer device, wherein the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device conducts heat from a wave of molten solder to the plane. |
| 地址 |
Armonk NY US |
