| 摘要 |
<p>The problem addressed by the present invention is to obtain a mold release film having superior mold release characteristics (peeling characteristics) with respect to adhesive agents such as acrylic resin-based adhesive agents, epoxy resin-based adhesive agents, and the like, having no stickiness of a mold release layer, and having non-staining characteristics. The present invention pertains to the mold release film, which is characterized by resulting from the lamination, onto one surface of a substrate layer, of a mold release layer comprising a random copolymer (B) that is of ethylene and anα-olefin having at least 6 carbon atoms and that has a density of 865-880 kg/m3 and a melting point (Tm) of no greater than 70°C; and a method for producing the mold release film.</p> |
