| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with which a mounting structure improved in electrical reliability can be obtained, a mounting structure thereof, a manufacturing method of the wiring board, an insulation material and a manufacturing method of the insulation material.SOLUTION: A wiring board 3 comprises: a first insulation layer 13 including a plurality of particles 15 partially connected with each other and comprised of zirconia and a resin part 18 disposed in a gap G between the first particles 15; and a conductive layer 11 disposed on the side of one principal surface of the first insulation layer 13. Therefore, since the wiring board 3 can be made with low thermal expandability and high rigidity by the first insulation layer 13, warpage of the wiring board 3 in mounting or operating an electronic component 2 is reduced and a mounting structure 1 improved in electrical reliability can be obtained as a result. |
