| 发明名称 |
ULTRASONIC BONDING DEVICE AND STRUCTURE FOR BONDING TERMINAL AND ELECTRIC WIRE |
| 摘要 |
<p>An ultrasonic bonding device comprises: an anvil (10) on the upper surface (11a) of which an electric wire bonding portion (3) of a terminal (1) having a counterpart terminal connection portion (2) at the front and having the electric wire bonding portion (3) at the back thereof is mounted; an ultrasonic horn (20) which is disposed above the anvil; and a terminal pressing member (50) which presses the electric wire bonding portion (3) against the upper surface of the anvil when ultrasonic vibration is applied.</p> |
| 申请公布号 |
WO2014104140(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
WO2013JP84760 |
申请日期 |
2013.12.25 |
| 申请人 |
YAZAKI CORPORATION |
发明人 |
KAWASE NOBUHIRO;SONE TAKAYUKI;SAKURAI HIDEKI;ITOH KEIICHIROH;UGAJIN HIROYUKI;MATSUNAGA SHINICHIRO;WATANABE MAKOTO |
| 分类号 |
H01R43/02;H01R4/02 |
主分类号 |
H01R43/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
